DINO-v3-Distilled

21%

by Fo’c’sle

Distilled DINO-v3 backbone for downstream perception. The encoder under most of our reference models.

MultimodalFocsle-ResearchINT8FP16backbonessldino

64K downloads 2.4K deploymentsUpdated Apr 12, 2028

Headline:14.8ms · NVIDIA Jetson Orin Nano · FP16

Overview Benchmarks6 Sim Results Deploy6 Files Discussion23

Cross-chip benchmark matrix

Every supported chip, in matched-pair runs from the Fo’c’sle HIL lab. Sortable by any column — click a header. Cells where the chip can’t run this model show Not supported.

Chip platform	Quant	Latency p50(ms)	Latency p95(ms)	Throughput	Acc. retention(%)	Power(W)	Memory(MB)	Tested by
N NVIDIA Jetson Thor 2070 TOPS · Module	FP16	18.2	23.7	55 FPS	99.8	122.3	204	Fo’c’sle HIL
N NVIDIA Jetson AGX Orin 275 TOPS · Module	FP16	26.1	33.6	38 FPS	99.7	55.4	204	Fo’c’sle HIL
Q Snapdragon 8 Gen 3 NPU 45 TOPS · SoC	INT8	38.2	45.8	26 FPS	98.4	6.4	102	Fo’c’sle HIL
Q Qualcomm QCS8550 48 TOPS · SoC	INT8	53.4	64.0	19 FPS	98.5	14.1	102	Fo’c’sle HIL
N NVIDIA Jetson Orin Nano 40 TOPS · SoM	INT8	63.6	80.3	16 FPS	97.4	12.6	102	Fo’c’sle HIL
Apple Neural Engine (M4) 38 TOPS · SoC	FP16	78.1	99.5	13 FPS	99.8	7.1	204	Fo’c’sle HIL
H Hailo-8 26 TOPS · M.2	Not supported
H Hailo-10H 40 TOPS · M.2	Not supported
Q Qualcomm QCS6490 12 TOPS · SoC	Not supported
π Raspberry Pi 5 + Hailo HAT 26 TOPS · HAT	Not supported
A Ambarella CV5 16 TOPS · SoC	Not supported
A Ambarella CV72 32 TOPS · SoC	Not supported
M MediaTek Genio 700 4 TOPS · SoC	Not supported
G Google Coral Edge TPU 4 TOPS · USB	Not supported
I Intel Movidius Myriad X 4 TOPS · SoC	Not supported
A AMD Versal AI Edge VE2302 22 TOPS · SoC	Not supported
R Rockchip RK3588 6 TOPS · SoC	Not supported

Leader per columnMS-COCO captions · 224×224 image / 32-token text

HIL conditions

All numbers measured on Fo’c’sle HIL rigs in Tel Aviv (primary), Munich (secondary), and Pittsburgh (robotics). Single-stream, batch-1, real preprocessing, real downstream consumer. p50/p95 are over 10,000-frame steady-state windows after a 30-second warm-up. Power draw is package power, not wall power. Memory footprint is the resident model + activations footprint at peak — not on-disk.

Submitted publisher numbers are accepted only if they reproduce within ±8% of an HIL-lab matched run on the same chip in the same input mode. Otherwise they live separately under the Discussion tab.