SmolVLM-3B

33%

Compact VLM that comfortably runs on a Jetson Orin Nano. The default 'on-device assistant for cameras' pick.

MultimodalApache-2.0INT8MIXEDvlmsmolcaptioning

184K downloads 6.4K deploymentsUpdated Apr 9, 2028

Headline:142ms · NVIDIA Jetson Orin Nano · INT8

Overview Benchmarks7 Sim Results Deploy7 Files Discussion23

Cross-chip benchmark matrix

Every supported chip, in matched-pair runs from the Fo’c’sle HIL lab. Sortable by any column — click a header. Cells where the chip can’t run this model show Not supported.

Chip platform	Quant	Latency p50(ms)	Latency p95(ms)	Throughput	Acc. retention(%)	Power(W)	Memory(MB)	Tested by
N NVIDIA Jetson Thor 2070 TOPS · Module	MIXED	110.8	131.7	9 FPS	99.3	111.0	4,956	Publisher
N NVIDIA Jetson AGX Orin 275 TOPS · Module	MIXED	152.7	188.8	6.6 FPS	98.8	50.5	4,956	Community
H Hailo-10H 40 TOPS · M.2	INT8	315.5	403.9	3.2 FPS	98.0	3.2	3,540	Fo’c’sle HIL
Apple Neural Engine (M4) 38 TOPS · SoC	MIXED	342.2	421.9	2.9 FPS	99.4	7.3	4,956	Community
Q Qualcomm QCS8550 48 TOPS · SoC	INT8	348.8	451.5	2.9 FPS	98.4	11.8	3,540	Publisher
Q Snapdragon 8 Gen 3 NPU 45 TOPS · SoC	INT8	352.8	434.0	2.8 FPS	97.3	7.3	3,540	Publisher
N NVIDIA Jetson Orin Nano 40 TOPS · SoM	INT8	422.1	535.7	2.4 FPS	98.7	13.3	3,540	Fo’c’sle HIL
H Hailo-8 26 TOPS · M.2	Not supported
Q Qualcomm QCS6490 12 TOPS · SoC	Not supported
π Raspberry Pi 5 + Hailo HAT 26 TOPS · HAT	Not supported
A Ambarella CV5 16 TOPS · SoC	Not supported
A Ambarella CV72 32 TOPS · SoC	Not supported
M MediaTek Genio 700 4 TOPS · SoC	Not supported
G Google Coral Edge TPU 4 TOPS · USB	Not supported
I Intel Movidius Myriad X 4 TOPS · SoC	Not supported
A AMD Versal AI Edge VE2302 22 TOPS · SoC	Not supported
R Rockchip RK3588 6 TOPS · SoC	Not supported

Leader per columnMS-COCO captions · 224×224 image / 32-token text

HIL conditions

All numbers measured on Fo’c’sle HIL rigs in Tel Aviv (primary), Munich (secondary), and Pittsburgh (robotics). Single-stream, batch-1, real preprocessing, real downstream consumer. p50/p95 are over 10,000-frame steady-state windows after a 30-second warm-up. Power draw is package power, not wall power. Memory footprint is the resident model + activations footprint at peak — not on-disk.

Submitted publisher numbers are accepted only if they reproduce within ±8% of an HIL-lab matched run on the same chip in the same input mode. Otherwise they live separately under the Discussion tab.