YOLO26-Nano

Tiny variant tuned for sub-watt accelerators. Where the Coral TPU still earns its place.

Object detectionMITINT8INT4cocotinylow-power

1.2M downloads 71K deploymentsUpdated Mar 22, 2028

Headline:4.8ms · Google Coral Edge TPU · INT8

Overview Benchmarks9 Sim Results Deploy10 Files Discussion23

Cross-chip benchmark matrix

Every supported chip, in matched-pair runs from the Fo’c’sle HIL lab. Sortable by any column — click a header. Cells where the chip can’t run this model show Not supported.

Chip platform	Quant	Latency p50(ms)	Latency p95(ms)	Throughput	Acc. retention(%)	Power(W)	Memory(MB)	Tested by
Q Qualcomm QCS8550 48 TOPS · SoC	INT8	4.71	6.01	212 FPS	98.5	12.9	4	Community
A Ambarella CV72 32 TOPS · SoC	INT8	6.25	7.98	160 FPS	97.7	5.2	4	Community
π Raspberry Pi 5 + Hailo HAT 26 TOPS · HAT	INT8	7.70	9.62	130 FPS	97.9	6.9	4	Publisher
H Hailo-8 26 TOPS · M.2	INT8	8.28	10.5	121 FPS	97.5	2.3	4	Publisher
Q Qualcomm QCS6490 12 TOPS · SoC	INT8	12.5	15.2	80 FPS	98.9	8.2	4	Fo’c’sle HIL
A Ambarella CV5 16 TOPS · SoC	INT8	14.3	18.2	70 FPS	97.2	4.0	4	Community
R Rockchip RK3588 6 TOPS · SoC	INT8	19.8	25.9	51 FPS	98.0	9.3	4	Publisher
G Google Coral Edge TPU 4 TOPS · USB	INT8	24.1	30.1	42 FPS	97.8	1.5	4	Community
I Intel Movidius Myriad X 4 TOPS · SoC	INT8	26.3	32.3	38 FPS	97.8	2.4	4	Fo’c’sle HIL
M MediaTek Genio 700 4 TOPS · SoC	In progress
H Hailo-10H 40 TOPS · M.2	Not supported
Q Snapdragon 8 Gen 3 NPU 45 TOPS · SoC	Not supported
N NVIDIA Jetson Orin Nano 40 TOPS · SoM	Not supported
N NVIDIA Jetson AGX Orin 275 TOPS · Module	Not supported
N NVIDIA Jetson Thor 2070 TOPS · Module	Not supported
A AMD Versal AI Edge VE2302 22 TOPS · SoC	Not supported
Apple Neural Engine (M4) 38 TOPS · SoC	Not supported

Leader per columnCOCO 2017 val · 1080p input · single-stream, batch=1

HIL conditions

All numbers measured on Fo’c’sle HIL rigs in Tel Aviv (primary), Munich (secondary), and Pittsburgh (robotics). Single-stream, batch-1, real preprocessing, real downstream consumer. p50/p95 are over 10,000-frame steady-state windows after a 30-second warm-up. Power draw is package power, not wall power. Memory footprint is the resident model + activations footprint at peak — not on-disk.

Submitted publisher numbers are accepted only if they reproduce within ±8% of an HIL-lab matched run on the same chip in the same input mode. Otherwise they live separately under the Discussion tab.