FocsleFocsle
Fo’c’sle

Depth-Anything-Edge

41%
by Fo’c’sle

Distilled depth model that holds 0.32 AbsRel on KITTI while running 60 FPS on a Pi 5 + Hailo HAT. The reference release.

DepthFocsle-ResearchINT8FP16MIXEDdistilledmonocularkitti
198K downloads 15K deploymentsUpdated Apr 16, 2028
Headline:16.8ms · Raspberry Pi 5 + Hailo HAT · INT8

Cross-chip benchmark matrix

Every supported chip, in matched-pair runs from the Fo’c’sle HIL lab. Sortable by any column — click a header. Cells where the chip can’t run this model show Not supported.

Chip platformQuantLatency p50(ms)Latency p95(ms)ThroughputAcc. retention(%)Power(W)Memory(MB)Tested by
N
NVIDIA Jetson Thor
2070 TOPS · Module
MIXED5.857.64171 FPS99.391.768Fo’c’sle HIL
N
NVIDIA Jetson AGX Orin
275 TOPS · Module
MIXED9.5212.5105 FPS99.155.168Fo’c’sle HIL
H
Hailo-10H
40 TOPS · M.2
INT823.829.742 FPS97.63.349Fo’c’sle HIL
N
NVIDIA Jetson Orin Nano
40 TOPS · SoM
INT825.130.140 FPS97.312.249Fo’c’sle HIL
Q
Qualcomm QCS8550
48 TOPS · SoC
INT826.431.738 FPS97.411.749Fo’c’sle HIL
Apple Neural Engine (M4)
38 TOPS · SoC
MIXED29.238.734 FPS98.76.968Fo’c’sle HIL
A
Ambarella CV72
32 TOPS · SoC
INT830.238.633 FPS97.35.749Fo’c’sle HIL
π
Raspberry Pi 5 + Hailo HAT
26 TOPS · HAT
INT836.647.327 FPS97.97.649Fo’c’sle HIL
H
Hailo-8
26 TOPS · M.2
INT840.952.124 FPS98.62.349Fo’c’sle HIL
Q
Qualcomm QCS6490
12 TOPS · SoC
Not supported
Q
Snapdragon 8 Gen 3 NPU
45 TOPS · SoC
Not supported
A
Ambarella CV5
16 TOPS · SoC
Not supported
M
MediaTek Genio 700
4 TOPS · SoC
Not supported
G
Google Coral Edge TPU
4 TOPS · USB
Not supported
I
Intel Movidius Myriad X
4 TOPS · SoC
Not supported
A
AMD Versal AI Edge VE2302
22 TOPS · SoC
Not supported
R
Rockchip RK3588
6 TOPS · SoC
Not supported
Leader per columnKITTI 2015 stereo eval · 1216×352 · monocular

HIL conditions

All numbers measured on Fo’c’sle HIL rigs in Tel Aviv (primary), Munich (secondary), and Pittsburgh (robotics). Single-stream, batch-1, real preprocessing, real downstream consumer. p50/p95 are over 10,000-frame steady-state windows after a 30-second warm-up. Power draw is package power, not wall power. Memory footprint is the resident model + activations footprint at peak — not on-disk.

Submitted publisher numbers are accepted only if they reproduce within ±8% of an HIL-lab matched run on the same chip in the same input mode. Otherwise they live separately under the Discussion tab.